Thursday, October 14, 2010

Thin-Film PV Substrate and Encapsulation Market to reach $1.3 billion by 2015 - Nanomarket Report

Glen Allen, Virginia: A new report from industry analyst firm
NanoMarkets says that, while glass will continue to dominate substrate
and encapsulation materials used for thin-film photovoltaics (TFPV),
new materials including metal foils, plastics, ceramics and composites
will grow rapidly in importance. The main driver for using these new
materials will be the need to support flexible PV in order to reduce
PV panel costs using R2R processes and the rise of "intrinsically
flexible products; notably those used for building-integrated PV

In total, the TFPV substrate/encapsulation market is expected to reach
$1.3 billion by 2015, going on to reach $1.8 billion by 2017. And
while some of the most advanced encapsulation systems have proved
difficult to develop and come with a high cost, NanoMarkets has
identified several areas where these systems are beginning to make
economic sense, most notably in the CIGS sector.

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